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- Wafer Bumping
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- Customer inventory management And Monitoring
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- Package, Substrate and Leadframe Replication
- Ability to re-introduce most package technologies
- JEDEC and custom package outlines
- Qualification services available
- ROHS/SnPb lead finishes available
- Substrate and leadframe design services available
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- Product Recreation
- Electrical Performance Recreation
- Form-Fit-Function Recreation
- Memory Repackaging
We offer our services across United States, Latin America, The Pacific Rim, Africa, South East Asia, Europe, and the Middle East.