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- Baking
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- Component Solutions
- BGA Reballing
- CGA Attach
- Configurable for other plating solutions
- Flexible rack plating system supports plating of leadframes and other electronic components
- Lead Attach / Component Preparation
- Pre-plated RoHs frames
- Robotic Hot Solder Dip & Exchange
- SnPb, Matte Sn, and Ni Plating
- Solder dip options
- Trim & Form and Reconditioning
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- Die Banking
- Long-Term Storage
- Long-term storage and managed logistics manufacturing programs
- Lot acceptance and reliability test services to ensure full product functionality
- Parts management
- Usage reporting
- Next-Generation Storage
- Auto-purge on power fail
- Enhanced ESD controls
- ISO-5 Inspection areas
- ISO-7/10K certified
- Real-time monitoring of temperature and humidity
- Relative humidity control
- Secure room and individual cabinets
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- Electronic Component Recycling
We will collect, sort, recycle, and dispose of electronic waste. Our primary goal is to properly destroy private data with the intent or repurposing salvageable electronics with the aim of protecting the environment. We cater to the customer needs. We specialize in the safe disposal with full data protection of medical, telecom equipment and electronic components and sub-assemblies and much more. We accept all types of electronic waste that you want to get rid of.
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- KITTING
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- Marking/ Remarking & labeling
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- Packaging Solutions
- Assembly Services
- CSP/Plastic Assembly
- Automated saw, die attach and wire bond equipment
- Custom assembly solutions
- Epoxy die attach
- Flexible manufacturing space supporting a range of volumes
- Full automold and semi-automated mold equipment
- Gold ball bond
- Leadframe options including: design/replication, pre-plated, spot plated
- Qualification services available
- Custom Packaging
- Open Cavity Packaging
- Final Test
- Hermetic Assembly
- Automated and semi-automated assembly equipment
- Commercial and Military flows
- DLA certified
- Eutectic, Silver Glass and Epoxy Die Attach
- Flexible equipment to handle mix of package types
- Frit, Solder Seal and Metal Can Sealing
- In-house reliability testing
- Package replications including leadframes
- Qualification services available
- Multi-Chip Modules
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- Programming Services
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- Screening
- Screening
- Screening MIL-STD-750
- Screening MIL-STD-751
- Screening MIL-STD-883
- Screening of 2000+ pin counts
- Screening of CPLD
- Screening of FPGA
- Screening of PLD
- Screening, Reliability and Qualification of ASIC Devices
- Screening, Reliability and Qualification of COTS Devices
- Screening, Reliability and Qualification of FPGA Devices
- Up-screening
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- Support Solutions
- Burn-in test
- Customized Flows and Qualification Plans
- Device Characterization
- HAST/THB Testing - Atmospheric and Humidity Tests
- Preconditioning and Moisture Sensitivity testing
- Rapid Temp Cycle and Thermal Shock testing
- Reverse Engineering
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- Tape and Reel
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- Tinning Services
- HI-REL Tinning Services
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- Wafer Processing, Testing and Storage
- Die inspection
- Die pick and place
- Wafer AC parameters
- Wafer Anti-counterfeit validation
- Wafer Application specific I/O test
- Wafer back-side grind
- Wafer bumping
- Wafer Data sheet verification
- Wafer DC parameters
- Wafer dicing
- Wafer grinding
- Wafer Known Good Die
- Wafer Lot Radiation Screening, Characterization, and Qualification
- Wafer saw
- Wafer Speed Binning
- Wafer Temperature Binning
- Wafer Testing
- Wafer - Function Tests
- Wafer “in family” data segregation
- Waffle/Gel Pack sorting
We offer our services across United States, Latin America, The Pacific Rim, Africa, South East Asia, Europe, and the Middle East.